发明名称 |
METHOD AND DEVICE FOR CLEANING REACTION CHAMBER |
摘要 |
PROBLEM TO BE SOLVED: To reduce damages to each part in a reaction chamber caused by, plasma, and to enable the uniform cleaning. SOLUTION: In a plasma CVD device to introduce a treatment gas into a reaction chamber 1 and form a film on a substrate 3 using the treatment gas, a plasma generation unit 14 is provided on introduction piping 15 to introduce the cleaning gas in the reaction chamber 1, the cleaning gas is activated by the plasma generated in a plasma generation unit 14 during a spare time to form the film on the substrate, and the activated cleaning gas is introduced in the reaction chamber 1 to clean the inside of the reaction chamber 1.
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申请公布号 |
JP2001020076(A) |
申请公布日期 |
2001.01.23 |
申请号 |
JP19990191942 |
申请日期 |
1999.07.06 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
TOYODA KAZUYUKI;TANAKA TSUTOMU;MAKIGUCHI KAZUMASA;SATO TAKAYUKI |
分类号 |
H01L21/302;C23C14/00;C23C16/44;C23F4/00;H01L21/3065;H01L21/31;(IPC1-7):C23C16/44;H01L21/306 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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