发明名称 METHOD AND DEVICE FOR CLEANING REACTION CHAMBER
摘要 PROBLEM TO BE SOLVED: To reduce damages to each part in a reaction chamber caused by, plasma, and to enable the uniform cleaning. SOLUTION: In a plasma CVD device to introduce a treatment gas into a reaction chamber 1 and form a film on a substrate 3 using the treatment gas, a plasma generation unit 14 is provided on introduction piping 15 to introduce the cleaning gas in the reaction chamber 1, the cleaning gas is activated by the plasma generated in a plasma generation unit 14 during a spare time to form the film on the substrate, and the activated cleaning gas is introduced in the reaction chamber 1 to clean the inside of the reaction chamber 1.
申请公布号 JP2001020076(A) 申请公布日期 2001.01.23
申请号 JP19990191942 申请日期 1999.07.06
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TOYODA KAZUYUKI;TANAKA TSUTOMU;MAKIGUCHI KAZUMASA;SATO TAKAYUKI
分类号 H01L21/302;C23C14/00;C23C16/44;C23F4/00;H01L21/3065;H01L21/31;(IPC1-7):C23C16/44;H01L21/306 主分类号 H01L21/302
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