| 摘要 |
PROBLEM TO BE SOLVED: To achieve the cutting of an object to be cut without buckling even when a thin sample is cut by cutting such an object, with an anti-warpage member attached to both side faces of the object, when a conductor is wound around a spot to be cut of the object and a pulsed magnetic field is applied to cut the object. SOLUTION: When an object 4 to be cut is cut, first a groove is formed along a spot to be cut on the circumferential face of the object 4 and a conductor 5 is wound around the groove. Next a silicone disc is attached as an anti- warpage member to both side faces of the object 4 using an adhesive, and then the center axis of the object 4 is made to coincide with the center axis of a primary coil 3. Further, the primary coil 3, the object 4 and the conductor 5 are arranged in such a way that these are not brought into contact electrically with each other. After that, voltage is applied to a capacitor 1 and a switch 2 is made to run current to the primary coil 3. Thus the object 4 is cut at the spot to be cut. Even when a thin sample is cut, it can be cut without bucking or braking in pieces.
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