发明名称 REMOVABLE ADHESIVE TAPE
摘要 PROBLEM TO BE SOLVED: To obtain a removable adhesive tape capable of protecting a board resin and a circuit pattern in the production or the like of a circuit board, and capable of being readily removed after finishing the process by laminating an acrylic adhesive layer obtained by formulating a specific amount of a specified polyfunctional compound or the like with a specific acrylic polymer, on a supporter. SOLUTION: This removable adhesive tape is obtained by laminating (A) an acrylic adhesive layer obtained by formulating (ii) a polyfunctional compound having plural functional groups reacting with carboxyl groups of an acrylic polymer in the molecule, or the polyfunctional compound and a monofunctional compound having one of the functional group, with (i) the acrylic polymer obtained by copolymerizing a monomer mixture comprising 3-20 wt.% radically polymerizable monomer containing the carboxyl group and a 4-12C alkyl (meth) acrylate as an essential ingredient monomer so that the equivalent ratio of the functional groups may be >=0.8, on (B) at least one surface of a supporter. The adhesive preferably further contains a plasticizer.
申请公布号 JP2001019915(A) 申请公布日期 2001.01.23
申请号 JP19990196084 申请日期 1999.07.09
申请人 SEKISUI CHEM CO LTD 发明人 SHIMOMURA KAZUHIRO;DANJO SHIGERU;OYAMA YASUHIKO
分类号 C09J7/02;C09J133/02;C09J133/06;C09J135/00;C09J201/02;(IPC1-7):C09J7/02 主分类号 C09J7/02
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