发明名称 Method of forming polycide
摘要 The method of forming a polycide that includes the steps of forming an insulating layer on a substrate, forming a first semiconductor layer on the insulating layer and forming a metal-ion buried layer in the first semiconductor layer; wherein the metal-ion buried layer is formed to be located to a predetermined depth from an upper surface of the first semiconductor layer. An impurity-ion buried layer is formed under the metal-ion buried layer in the first semiconductor layer such that the impurity-ion buried layer makes the first conductive layer electrically-conductive. A silicide layer and a conductive second semiconductor layer are formed by carrying out thermal treatment on the metal-ion buried layer and the impurity-ion buried layer.
申请公布号 US6177335(B1) 申请公布日期 2001.01.23
申请号 US20000522069 申请日期 2000.03.09
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 PARK JI-SOO;SOHN DONG-KYUN
分类号 H01L21/28;H01L29/49;(IPC1-7):H01L21/20 主分类号 H01L21/28
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