MOLD FOR MOLDING SYNTHETIC RESIN, MOLD TEMPERATURE REGULATING DEVICE, AND METHOD FOR REGULATING MOLD TEMPERATURE

摘要

PROBLEM TO BE SOLVED: To perform heating and cooling of a mold in a short time by providing a gap for an estimated expansion of an insert in the fitted part between the insert and a matrix, in the mold which has the insert in the matrix and a heat insulating layer between the matrix and the insert with a flow path formed near the surface of a cavity in the insert. SOLUTION: The mold to be used for injection-molding or compression- molding a thermoplastic resin, a heat-curable resin or the like has an insert 2 provided in a matrix 1, a cavity 3 being formed in the insert 2. In this case, a gap t1 for an estimated expansion of the insert 2 is provided in the fitted part between the insert 2 and the matrix 1, and is set so that the thermal stress to be generated during the expansion of the insert 2 is 100 MPa or less, preferably 50 MPa or less. Further, a fitted part with a smaller gap t2 which is smaller than the gap t1 is provided in the fitted part between the insert 2 and the matrix 1. The gap t2 is set within the range of 30μm or less, preferably 20μm or less and further preferably 10-1μm.