发明名称 Process for recycling reaction system of electroplating passivation of wafers
摘要 A process for recycling a reaction system of electroplating passivation of wafers, in which lanthanum hydroxide (La(OH)3) or magnesium hydroxide (Mg(OH)2) is added to supplement the lanthanum ion or magnesium ion consumed in an electroplating solution when the pH of the electroplating solution decreases to a range from 0.1 to 0.4.
申请公布号 US6176993(B1) 申请公布日期 2001.01.23
申请号 US19990246959 申请日期 1999.02.09
申请人 GENERAL SEMICONDUCTOR OF TAIWAN, LTD. 发明人 CHIOU JEMY CHIEN-WEN
分类号 C25D21/18;H01L21/316;(IPC1-7):C25P21/18 主分类号 C25D21/18
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