| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for insulating layer formation which is capable of preventing the failure in the formation of openings and the malformation of the radius or shape thereof caused by curing before irradiation of an ultraviolet light to the resin compsn. by the action of a curing agent, during formation of an inter-layer resin insulating layer and an solder resist layer, of causing no crack and delamination in a heat cycle test, and of providing a printed wiring board excellent in connection and reliability. SOLUTION: This resin compsn. for insulating layer formation contains a thermosetting resin and/or a thermoplastic resin, a photosensitive resin, and a curing agent precursor, wherin the curing agent precursor releases a curing component bonded to the precursor by a rearrangement reaction within the molecule of the precursor caused by irradiation of an ultraviolet light. It is pref. that the reaction initiates from the reaction of an acid or an alcohol in the curing agent precursor.
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