发明名称 |
Ball bonding method on a chip |
摘要 |
A ball bonding method on a chip mainly comprises steps of: a wire is burned to form a ball on a capillary; the capillary is moved down to a second bonding point for ball bonding; and the capillary is moved up in a vertical direction thereby pulling the tip of the ball to be cut such that the ball has a uniformly body shape and tip height. Therefore, the ball provides uniform body shape and tip height for wire bonding at a second bonding point under lower variability conditions thus increasing the reliability of products.
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申请公布号 |
US6176417(B1) |
申请公布日期 |
2001.01.23 |
申请号 |
US19990419288 |
申请日期 |
1999.10.15 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING INC. |
发明人 |
TSAI YU-FANG;TAO SU;LEE SIMON;CHEN TAO YU |
分类号 |
B23K20/00;H01L21/60;H01L21/603;H01L21/607;(IPC1-7):B23K31/00;B23K31/02;H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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