| 摘要 |
PROBLEM TO BE SOLVED: To directly connect a light source to a substrate for miniaturization by setting the distance between light emission and reception surfaces to be a specific value or smaller. SOLUTION: A light-emitting device 101 and a photoconductive switch element 102 are molded completely with epoxy resin. By filling the epoxy resin excluding the entire or one portion of the space between an emission region 106 for emitting light to the light-emitting device 101 and a photoconductive switch 107, a material with a large dielectric constant placed near the photoconductive switch decreases, thus reducing the open capacity of the photoconductive switch element and hence the entire portion can be reduced and electrical wiring shortened. Also, for connection pads 108 and 109, multilayer structure of for example nickel and gold that can be easily applied to a tin/lead alloy is selected. A bump 103 is made of the tin/lead alloy, and the connection pads 108 and 109 are connected mechanically and electrically. For enabling light from the light-emitting device 101 to efficiently drive the photoconductive switch, the distance between opposing light-emitting surface and light reception surface is set to be 100 μm or shorter. |
