发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 PROBLEM TO BE SOLVED: To improve charge-transfer efficiency in the case of the transfer of a small quantity of charges, and to reduce a fraction defective by forming the trench of potential arranged along the transfer section of a vertical transfer section to a part of the vertical transfer section. SOLUTION: The potential of a part of the vertical transfer sections 6 of the CCD solid-state image pickup device is made deep deliberately, and trenches 6-1 of potential are formed. Charges are transferred by using the trenches 6-1 of potential in the case of a small quantity of signal charges. The positions of the trenches 6-1 of potential are formed at the central sections of the vertical transfer sections 6 taking into consideration the two-dimensional effects of the potential of the vertical transfer sections. Thus, probability of encounters to the defects (that is, positions where potential is deepened partially) of the vertical transfer sections 6 is made smaller than the transfer by using the vertical transfer sections 6 as a whole in transfer by using parts (the trenches) of the vertical transfer sections 6. Accordingly, the defects of the CCD solid-stage image pickup device also decrease due to the deepening of the potential of parts of the vertical transfer sections 6.
申请公布号 JP2001015732(A) 申请公布日期 2001.01.19
申请号 JP19990188777 申请日期 1999.07.02
申请人 SONY CORP 发明人 YOSHIDA MASASHI;WADA TAKAHIRO;TANIGAWA KOICHI
分类号 H01L21/339;H01L27/148;H01L29/762;H04N5/335;H04N5/341;H04N5/367;H04N5/369;H04N5/372;(IPC1-7):H01L27/148 主分类号 H01L21/339
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