| 摘要 |
PROBLEM TO BE SOLVED: To prevent inaccurate conversion of an image information into an electric signal due to inaccurate positioning of the image sensor device opposite to the information signal, because the image sensor device is obliquely mounted without uniformly grinding a mounting part of an insulated substrate owing to partial adhesion of ground chips of metalized via conductors. SOLUTION: A package for housing an image sensor device consists of an insulated substrate 1 and a transimissive lid 2, and is flattened by grinding a mounting part 1a on the insulated substrate 1a in one direction. In this package, metalized via conductors 9 are approximately uniformly distributed in the short-side direction of the mounting part 1a. Ground chips of the metalized via conductors 9 adheres on a ground surface of a grindstone when grinding the mounting part 1a with the grindstone. Thus, the mounting part 1a can be ground for flattening.
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