| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance position accuracy of connection terminals of a package by connecting connection terminals of a first group to electrode terminals of a semiconductor chip and connecting connection terminals of a second group to inner lead terminals of the package substrate. SOLUTION: Electrode terminal bumps 6 of a semiconductor chip 5 are connected to connection terminals 13 of a first group that are arranged on central region of a scale-transfer substrate 3 with the same pitch as that of the bumps 6. The connection terminals 13 of the first group are connected to connection terminals 12 of a second group that are arranged on outer region of the same scale-transfer substrate 3 with conductive wiring. The connection terminals 12 of the second group are connected to inner leads 11 that are adjacent to an opening 20 of a package substrate 1, and further connected to solder balls 10 which are connection terminals arranged on outer leads of the package substrate 1.</p> |
