| 摘要 |
PROBLEM TO BE SOLVED: To provide a system for forming a plating layer of uniform film thickness on the processing plane of a substrate. SOLUTION: The substrate plating system comprises a mechanism 1 for holding a wafer W, an upper cup 10 for covering a wafer W held by the holding mechanism 1 from above, a positive electrode 14 disposed oppositely to the processing plane WF of the wafer W held by the holding mechanism 1 from above in the upper cup 10, a negative electrode 7 connected electrically with the wafer W held by the holding mechanism 1, a power supply unit 15 for supplying power such that a current flows between the positive electrode 14 and the negative electrode 7, first and second baffle plates 22, 24 having holes 21, 23 for passing electrolytic plating liquid disposed between the holding mechanism 1 and the positive electrode 14 in the upper cup 10, and an opening 25 for supplying electrolytic plating liquid to the processing plane WF of the wafer W held by the holding mechanism 1.
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