SOCKET FOR INSPECTING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE INSPECTING METHOD, AND MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To obtain a socket for inspecting semiconductor elements capable of appropriately absorbing variations in the height of a plurality of external projection electrodes. SOLUTION: In a tape circuit 2, electrode pads 7 are formed at locations corresponding to the arrangement of the solder bumps 6 of an IC 5. An elastomer sheet 1 is housed in a recess formed in a mother socket part 4 in an IC mounting part of the tape circuit 2 at which the electrode pads 7 are formed. The upper surface of the elastomer sheet 1 is constituted in such a way as to be higher than the location of the upper surface of the mother socket part 4. The contact surface between the tape circuit 2 and the elastomer sheet 1 is heightened approximately by 0.1 mm than a surface by which the tape circuit 2 is supported. As the tape circuit 2 is once deformed in the direction of loosening itself to maintain a loosened state to a certain load range when pressed from the side of a semiconductor element, it is possible to add load without increasing the tension of the tape circuit 2, to allow local deformation in the pad 7, and to absorb variations in height among the external projection electrodes 6 of the semiconductor element.