WIRE BONDING MACHINE AND MANUFACTURE OF SEMICONDUCTOR DEVICE EMPLOYING THE SAME

摘要

PROBLEM TO BE SOLVED: To enhance yield and reliability by increasing the breaking strength of the wire connecting portion on the bonding side of a semiconductor device. SOLUTION: This wire bonding machine is equipped with a capillary 3 as the bonding tool. A pressing face 3a provided from a top edge 3b to an outer edge 3e of the capillary 3 is angled at 16 degrees or more, reducing the pressing force on the plating layer of a bonding face 4c of an inner lead 4a when bonding load is applied by the capillary 3. This forms no nodules in the plating layer, preventing breakage of the wire bonding portion at the time of reflow.