RESIN SEALED ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the life of a resin sealed electronic device by coating the surface of a semiconductor power element opposite to a surface facing a heat sink with polyimide material, exposing a metallic heat sink base in the rear of a heat sink, and setting linear expansion coefficient of resin in a specified range. SOLUTION: In a power element 1, thermal stress from a mold material 7 is relaxed by using a power element wherein polyimide coating is applied to a part which becomes a contact surface with mold resin 7 during element manufacturing. A plating-free part is provided to a rear of a metallic heat sink 3 for improving adhesion with the mold resin 7 and thermal stress from the mold resin 7 is absorbed by the metallic heat sink 3. Furthermore, the mold resin 7 restrains thermal stress low by using mold resin whose linear expansion coefficient is between linear expansion coefficient of 3×10-6/ deg.C of the power element 1 and linear expansion coefficient of 17×10-6/ deg.C of copper in the metallic heat sink 3. Therefore, heat resistance cycle property can be improved.