METHOD FOR INSPECTING PACKAGING COMPONENT

摘要

PROBLEM TO BE SOLVED: To surely and quickly perform inspections on the presence/absence of voids in soldered sections between a printed board and an IC for void and in bumps and the sending of NG signals when voids are generated even when the IC is mounted on the printed board in an inclined state. SOLUTION: In a method inspecting packaging parts, a void 81 generated in the soldered section of an integrated circuit mounted on a printed board having a heat radiating effect is detected from X-ray images obtained by applying X rays to the circuit. The void 81 is detected by calculating the planar inclination which is applied for the calculation of the transmitting thickness of solder caused by the inclinations of the printed board and integrated circuit and performing threshold operation on the X-ray image in a plane which is lower than the obtained plane by a preset threshold.