发明名称 MANUFACTURE OF CAPACITOR, MANUFACTURE OF WIRING BOARD COMPRISING CAPACITOR, AND WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To attain finer wiring by transferring in specified order transfer plates where an electro-deposited resin layer is provided, by required numbers, onto a base material where a capacitor part is formed, and laminating a first metal layer, electro-deposited resin layer, and second metal layer, for forming a capacitor. SOLUTION: A transfer formation part 110 comprises a wiring part 111 and an electrode part 112 of a capacitor. A transfer formation 120 comprises a wiring part 121 and an electrode part 122 of a capacitor, while a transfer formation part 130 comprises a wiring part 131 and an electrode part 132 of a capacitor. Related to the wiring parts and electrode parts, an electro-deposited layer which follows the shape of a metal layer is provided under the metal layer. A first capacitor comprising a first metal layer 112A, electro-deposited resin layer 122B, and second metal layer 122A as well as a second capacitor comprising a second metal layer 122A, electro-deposited resin layer 132B, and third metal layer 132A are laminated at a capacitor part 160, as required, by the transfer plate where the electro-deposited resin layer is provided.
申请公布号 JP2001015883(A) 申请公布日期 2001.01.19
申请号 JP19990186563 申请日期 1999.06.30
申请人 DAINIPPON PRINTING CO LTD 发明人 KURAMOCHI SATORU
分类号 H01G13/00;H05K1/16;H05K3/20;(IPC1-7):H05K1/16 主分类号 H01G13/00
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