| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wiring board with shield cap the shield cap of which can be joined simultaneously to the wiring board at the time of mounting an element on the board, in a state where heat and gases generated inside the cap can be discharged easily to the outside and such a failure as the void, etc., hardly occurs at the element mounting section of the board and the junction of the cap. SOLUTION: The mounting pad of an element and the joining pad of a shield cap 2 are provided on the outermost surface of a wiring board 1 so that solder may be applied simultaneously to the pads. In addition, openings are provided on the side faces of the cap 2 and utilized as vent holes or convective heat transfer paths at solder reflowing time. Since the openings effectively work as the convective heat transfer paths when the cap is joined to the board 1 simultaneously at the time of mounting the element on the board 1, the soldered state of the element can be improved. In addition, the openings can be utilized effectively at the time of washing the residue of soldering flax, etc.
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