| 摘要 |
PROBLEM TO BE SOLVED: To guarantee the mountability of an electronic component on an equipment enclosure and a circuit board and to respond to the demand for a clean environment in recent years. SOLUTION: In a structure in which an electronic component 64 with package are mounted on the package mounting surface 62a of an equipment enclosure 62, at least two parallel set screws 4 are fixed to the enclosure 62 through the component 64, and a component retainer 3 which brings the package 64a of the component 64 into press-contact with the package receiving surface 62a is fitted to the screws 4 in a state where the retainer 3 can freely move forwards and backwards. The retainer 3 is urged by springs 5 in the direction in which the package 64a is brought into press-contact with the package receiving surface 52a.
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