| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for dicing a substrate in which a cutting tool is prevented from being broken frequently during dicing work to cause increase of tool cost or generation of a defective substrate product and work efficiency is prevented from lowering by decreasing the feeding speed so that the cutting tool is not broken. SOLUTION: The apparatus 40 for dicing a substrate comprises a base 14 for mounting a material substrate 12 on which a plurality of circuit substrates 32 are formed side by side, a cutting means 16 having a tool 38 for dicing the material substrate 12 into a plurality of circuit substrates 32, and means 20 provided on the base 14 for supporting the cutting means 16 movably in the orthogonal X, Y, Z axis directions. The dicing tool 38 has a conical part 38b formed at the forward end part of a rod-like shank 38a and an edge 38c formed in the circumferential direction on the cross-section at the conical part 38b by cutting a part thereof.
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