| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a fine wiring pattern on a flexible circuit board stably even if the flexible circuit board partially contains a fine wiring pattern. SOLUTION: Both the surfaces of a double-sided copper plated laminated board 1 are subjected to a through-hole plating treatment thinner than usual, and then a fine wiring pattern is formed at a necessary position. Then, the formed fine wiring pattern 3 is subjected to a masking treatment, then the copper plated laminated board 1 is subjected to a through-hole plating treatment again so as to be plated as thick as prescribed, and lastly other necessary wiring patterns 6 and 7 other than the fine wiring pattern 3 are formed.
|
