| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a hermetically sealed electronic circuit case in such an environment that the temperature in the environment frequently rises to high values, by installing a sealant storing section to a vent hole which communicates the inside and outside of the case with each other, and using a thermosetting resin which becomes an air-permeable liquid in the initial stage of heating and cures thereafter as a sealant. SOLUTION: An electronic circuit 6 housed in a hermetically sealed electronic circuit case is sealed with a silicon gel 7 which secures insulation and relieves vibrations after the circuit 6 is fixed to the main case 1 of the case with an adhesive 8. In addition, a cover 2 is fixed to the case 1 for closing the opening of the case 1 which is provided for housing the circuit 6 in the case 1 with a thermosetting adhesive, such as the epoxy adhesive, etc. After the opening is closed with the cover 2, a vent hole 10 which is provided for preventing the internal pressure of the case 1 from rising when the adhesive cures is sealed with an adhesive 5. The amount of the adhesive 5 is increased immediately before the inside air of the case 1 is discharged by installing an adhesive storing section to the vent hole 10. |
