| 摘要 |
PROBLEM TO BE SOLVED: To achieve a method for mounting electronic components that can prevent pickup mistakes and the damage to electronic components by eliminating the press-contact to the electronic components. SOLUTION: In the method for mounting electronic components, electronic components 6 retained by a carrier tape 7 are picked up by a nozzle 11 of a transfer head and are mounted on a substrate. In this case, the height position of a height detection point H of the upper surface of the carrier tape 7 for retaining the electronic components is detected by a height position detection means that is provided at a transfer head, the height position is registered at a storage part as the parts height position of the position electronic components 6 being corrected by a height difference of D, and the descent stroke of the nozzle 11 in a transfer operation is controlled based on the registered data, thus eliminating the need for directly pressing the nozzle 11 to the upper surface of the electronic components 6 and hence preventing such inconveniences as the damage of the electronic components 6 and pickup mistakes due to the sealing of the electronic components 6 to a bottom tape 8. |
