| 摘要 |
PROBLEM TO BE SOLVED: To solder a component to a board in an accurate mounting position by providing recessed parts filled with solder in a soldering surface to a connecting pad at equal pitches along the outer periphery of the soldering surface. SOLUTION: A specified wiring pattern is placed and formed on a mounting board 1, and a spacer 3 is soldered onto a connecting pad 2 of the wiring pattern. A female screw part 3a for screwing an objective part is provided to a center part of the spacer 3, and the connecting pad 2 is formed into a circular shape in a size larger than a rear surface of the spacer 3. A plurality of recessed parts 4 filled with solder are provided to a soldering surface of the spacer 3, and each of these recessed parts 4 is so formed into a fan-shape as to leave a grounding surface 12 radially from the center, and placed at equal pitches along the outer periphery of the soldering surface.
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