SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To suppress defects from occurring due to electromigration, while suppressing the increase of manufacturing cost. SOLUTION: A semiconductor device has W via plugs 106 filled in vias 105 which pierces a second layer insulation film 104, an Al alloy upper wiring 103, a first insulation film 102 and an Al alloy lower wiring 101. The W via plugs 106 are connected to the side face of the upper wiring 103 and cuts off the length of this wiring 103. The plugs 106 are also connected to the side face of the lower wiring 101 and cuts off the length of this wiring 101. The divided Al wirings have a length L which is smaller than the critical length of electromigration.