| 摘要 |
PROBLEM TO BE SOLVED: To provide such a wiring board provided with a wiring layer on both surfaces of an insulation layer and a conductive layer on the inner wall surface of a through hole in the insulation layer that has no step between the wiring layer and conductive layer, and can be formed including the insulation layer without an electroless plating catalyst and is excellent in adhesion between the insulation layer and wiring layer. SOLUTION: A through hole 2 is formed in an insulation layer 1, and both surfaces 1a and 1b of the insulation layer 1 and the inner wall surface 2a of the through hole 2 are roughened physically, and then a plating catalyst is given to both surfaces 1a and 1b and the inner surface 2a. Furthermore, wiring layers 3 and 4 and a conductive layer 5 are formed on both surfaces 1a and 1b and the inner surface 2a thereof simultaneously and integrally by using an electroless plating layer or the lamination of an electroless plating layer and an electrolytic plating layer, so as to form a wiring board.
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