| 摘要 |
PROBLEM TO BE SOLVED: To obtain a single wafer cleaning apparatus and cleaning method in which the cost of chemical and the quantity of waste liquid are reduced while improving environmental issues by realizing in-plane uniformity of substrate processing process and shortening of processing time using a minimum necessary quantity of chemical. SOLUTION: The single wafer cleaning apparatus comprises pins 3 for holding the side face of a wafer 1 horizontally with minimum contact area, a rotary mechanism 9 for turning the wafer holding pins 3 at a specified speed, a mechanism 12 for driving the wafer holding pins 3 up and down, a pan 4 having an opening 5 for storing unnecessary chemical and discarding it as waste liquid 6, a packing 7 for enclosing the gap between the wafer holding pins 3 and the chemical storing pan 4 to prevent leakage of the waste liquid 6, and a rotary means 8 of spin cleaning section for turning the chemical storing pan 4.
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