| 摘要 |
PROBLEM TO BE SOLVED: To quickly attach/detach a semiconductor device, reduce a load applied to the fingertip, and enhance the efficiency of testing work by installing a projection for pressing in a cover for fixing an integrated circuit, fixed to a housing for housing the integrated circuit. SOLUTION: The semiconductor socket 2 has a housing 2A for housing an integrated circuit 1; a cover 2B for fixing the integrated circuit 1, fixed onto the housing 2A; and a projection 2C for pressing, installed in the cover 2B. When the cover 2B is pushed for attaching/detaching the integrated circuit 1, the surface of a part being pushed with the finger of the cover 2B is widened by the projection 2C installed in the cover 2B, and by the widened surface area, a plane part can be pushed with the finger, the distance between two fingers for pushing the cover 2B is widened, the integrated circuit 1 is smoothly attached/detached, and the replacing time of the integrated circuit 1 can be shortened.
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