PRODUCTION OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method for producing a semiconductor wafer in which thin semiconductor wafers can be sliced effectively. SOLUTION: A laminate 20 of a plurality of semiconductor wafers is mounted on a carbon slice plate 36 and clamped by means of a clamp base 24. The laminate 20 is lifted along with the clamp base 24 and the semiconductor wafers constituting the laminate 20 are sliced by means of a wire saw 12.