GROUNDING STRUCTURE FOR INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To simply and inexpensively ground an integrated circuit such as a CPU. SOLUTION: This grounding structure is equipped with a radiator 7 fixed to the socket 2 of a motherboard 1 to radiate heat generated from a CPU 5 mounted to the socket 2, and a clip 8 to fix the radiator 7 to the socket 2. The radiator 7 is formed by aluminum, and is composed of a plate body 9 having a flat contact part to be electrically and thermally brought into contact with the CPU 5 on its one side and radiating fins 10 provided on the other side of the plate body 9. The clip 8 is formed by a material having conductivity and is composed of a base part 13 having a part to be electrically brought into contact with the other side of the plate body 9 of the radiator 7 and a leg part 14 integrally formed at the both end parts of the base part 13 while having an engagement part to be engaged with the socket 2 at its tip part. A lead part 16 to be electrically brought into contact with the grounding conductive part 6 of the motherboard 1 is integrally formed.