发明名称 FLUX SUPPLY DEVICE IN CONDUCTIVE BALL MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a flux feed device which is capable of preventing dust from mixing in flux, restraining water-soluble flux from deteriorating in viscosity due to moisture absorption when water-soluble flux is used, and easily controlling an operation. SOLUTION: A flux supply device of a solder ball mounting device which mounts solder balls chucked up by an alignment mask on the connection terminals of a package by the use of an adhesive force of flux is equipped with a flux tank 24, squeegees 36 and 37 which are moved along the flux tank 24 to make the surface of flux smooth, a cover 40 that is provided with an opening 41 which the alignment mask passes through and covers the flux tank 24 and the squeegees 36 and 37, a door 46 which is supported in a slidable manner at the cover 40 to open or close the opening 41, and a piping 57 which is connected to the cover 40 and feeds gas into the cover 40.
申请公布号 JP2001015899(A) 申请公布日期 2001.01.19
申请号 JP19990189545 申请日期 1999.07.02
申请人 HITACHI VIA MECHANICS LTD;HITACHI LTD 发明人 NAITO YOSHITATSU;SUZUKI TAKAMICHI;DAIROKU NORIYUKI;INOUE KOSUKE;MORISHIMA MASAYUKI
分类号 B23K3/00;B23K3/06;B23K101/42;H01L21/60;H01L23/12;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K3/00
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