EXPOSURE METHOD, RETICULE AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an exposure method capable of reducing arraying errors so as to effectively use the shot area of an aligner. SOLUTION: A mark for measuring arraying errors to an adjacent patter is formed in the shot area of reticule (step S1) to expose and develop the mark on a wafer (step S2). Then, the arraying error of the mark on the wafer is measured (step S3) to calculate four error components (step S4). Finally, the aligner is corrected by using the calculated four error components (step S7). An arraying error at exposure to be conducted next is reduced.