CIRCUIT WIRING CONFIGURATION AND CIRCUIT WIRING METHOD, AND SEMICONDUCTOR PACKAGE AND SUBSTRATE THEREFOR

摘要

PROBLEM TO BE SOLVED: To produce optimum wiring candidate by automatically selecting combination for connecting a plurality of solder ball connection pads and a plurality of wire bond pads. SOLUTION: A wiring pattern as information for specifying a region wiring route for connection to each line and region wiring route for connection to the next line is produced for each line, by a wiring pattern generation part 61 from a line in a solder ball connection pad region near a wire bond pad, based on design conditions of a wiring route stored in a design condition storage part 41. A wiring plan wherein a plurality of wiring routes are laid out by combining the generated wiring pattern of each line is produced by a wiring plan generation part 62. A plurality of generated wiring plans which fit wiring rules are selected by a wiring rule check part 63, and a plurality of wiring candidates are produced. Furthermore, the generated wiring candidate is evaluated by a quality evaluation part 70 and an optimum wiring candidate can be selected.