| 摘要 |
PROBLEM TO BE SOLVED: To cool an electronic component down to its to lerable temperature or lower and downsize a cooling apparatus by disposing an electrostatic micro motor on a heat dissipating surface of the electronic component and providing vane pieces rising on an upper surface of the rotor, the micro motor comprising a rotor rotating around the axis disposed vertically to the heat dissipating surface. SOLUTION: A cooling apparatus 10 is composed of a number of fan units 1, and each of the fan units 13 has an electrostatic micro motor 4 and vane pieces 3. And the electrostatic micro motor 4 is composed of a rotor 7, a fixed center axis and a stator. The vane pieces 3 are provided on the rotor 7, the rotor 7 rotates around the fixed center axis, and the vane pieces 3 stir the air layer around a heat dissipating surface so as to break a boundary layer. Hence, it is possible to cool an LSI and so on down to a tolerable temperature or lower and to obtain a small cooling apparatus. Therefore, if this arrangement is used for an electronic component such as an LSI chip, small electronic equipment can be obtained with high capability.
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