发明名称 HEAT TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus which can reduce the amount of used gas necessary for temperature reduction by supplying the gas having an increased specific heat. SOLUTION: In the heat treatment apparatus, a heat plate 1 having a substrate W carried thereon for heat treatment is provided with a cooling jacket 5 of an air cooling type. The apparatus includes a bubbling tank 13 for generating a humidity applying gas. Temperature adjustment is carried out by supplying the humidity applying gas into the cooling jacket 5. By supplying the humidity applying gas having a specific heat increased in the bubbling tank 13, an amount of absorbable heat can be made large. Accordingly, the amount of gas consumed during temperature reduction of the plate 1 can be reduced.
申请公布号 JP2001015519(A) 申请公布日期 2001.01.19
申请号 JP19990181704 申请日期 1999.06.28
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MATSUSHITA MASANAO;SASADA SHIGERU
分类号 H01L21/324;(IPC1-7):H01L21/324 主分类号 H01L21/324
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