| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus which can improve the treatment efficiency by continuously treating a long substrate to be treated, while transferring the substrate. SOLUTION: A plasma treatment device is characterized, in that the device is composed of a transfer path 1 for transferring a long substrate A to be treated in its length direction and a treatment chamber 3, which is provided midway along the path 1 and through which the transported substrate A can be passed and continuously treats the substrate A in the chamber 3, by generating plasma in the chamber 3 through introducing a reaction gas to the chamber 3.
|
