METHOD FOR MOUNTING IC PACKAGE

摘要

PROBLEM TO BE SOLVED: To eliminate the need of any special visual inspection device by mounting an IC package on which marks are put in advance in a marking process on a board on which fixed points marked in advance while the fixed points of the board and the marks of the package are recognized. SOLUTION: Laser light is made incident to a lens and the accuracy of terminals (solder balls) formed on a substrate 10 on the backside of an IC package is discriminated through picture recognition based on the reflected light of the laser light. Then marks 2 are put on the surface of the IC package on the side opposite to the substrate 10 by means of a marker in a marking process. At the time of mounting the marked IC package on a mother board 4, fixed points 16 are marked in advance on the mother board 4, and the package is mounted on the board 4 while the fixed points 16 of the board 4 and the marks 2 of the package are recognized.