| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic component mounting method for efficiently mounting chips on a substrate by avoiding the decrease in mounting efficiency when a nozzle failure is generated in the electronic component mounting method for picking up the chips of a plurality of parts feeders with at least three nozzles. SOLUTION: The chips of parts feeders 4a-4g are simultaneously picked up by a first nozzle 9a, a second nozzle 9b, and a third nozzle 9c and are transferred and mounted on a substrate when it is normal. When a nozzle failure is generated in either of three nozzles 9a-9c, the mounting of chips by the failure nozzles is stopped, the simultaneous pickup and the dispersion pickup of the chips are made by another normal nozzle for mounting the substrate. As a result, by extremely reducing the number of pickup operations, mounting efficiency can be improved. |
