发明名称 COMPOUND LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DIODE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a compound light-emitting element of a constitution, wherein the layer thickness of a resin containing a fluorescent material, for making a wavelength conversion of light from the main light-extraction surface of a flip-chip light- emitting element into a wavelength conversion of white light is optimized and the pure white light is obtained, and to provide a light-emitting device and the manufacturing method of the device. SOLUTION: A flip-chip light-emitting element 1 conductively mounted on a submount element 2 is provided, the periphery of the element 1 is covered with a first resin 16 containing a fluorescent material for making a wavelength conversion of light from this element 1 using the element 2 as a saucer, either of the main light- extraction surface of the upper surface of a transparent substrate 1a of the element 1 and the shell surface (top panel) of the resin 16 or both of the main light-extraction- surface and the shell surface (top panel) is or are provided in parallel to the rear electrode formation surface of the element 2, the film thickness of the resin 16 on the main light-extraction surface is uniformly formed, and light from the entire main light-extraction surface of the element 1 is evenly made a wavelength conversion to enable an emission having not a color shading.
申请公布号 JP2001015817(A) 申请公布日期 2001.01.19
申请号 JP20000106037 申请日期 2000.04.07
申请人 MATSUSHITA ELECTRONICS INDUSTRY CORP 发明人 INOUE TOMIO;MAEDA TOSHIHIDE;OBARA KUNIHIKO
分类号 H01L33/06;H01L33/32;H01L33/34;H01L33/40;H01L33/50;H01L33/56;H01L33/60;H01L33/62;H01S5/022;H01S5/323;H01S5/343 主分类号 H01L33/06
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