| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a printed wiring board on which electronic components in any shape can be placed and mounted on its sealed parts and packing density of components can be improved even when electronic components such as semiconductor chips are buried in the board and sealed with resin. SOLUTION: A countersunk part with steps is formed in a core substrate 10 in which at least one layer of inner conductor wiring 11 is formed, an electrode of a semiconductor chip to be buried in the countersunk part is connected to the inner-layer conductor wiring through a bonding wire, the substrate is sealed with sealing resin 23 in such a way that its surface becomes uniform and a conductor wiring layer is layered on its upper layer through a built-up layer insulating layer 31.</p> |
