发明名称 OPTICAL AND ELECTRICAL WIRING BOARD AND MOUNTING BOARD
摘要 PROBLEM TO BE SOLVED: To allow high-density mounting or miniaturization by providing an optical path changing optical member on the side surface of an optical board. SOLUTION: An optical path changing optical member is provided for once deflecting laser beam 21 which is an optical signal from the side surface of optical boards 9 and 9', which is transferred to other optical boards 9' and 9. As the optical path changing optical member, specifically a prism 17 or optical fiber, etc., is used. The prism 17, etc., is bonded to the side surface of the optical boards 9 and 9' by an optical adhesive. If the side surface of the optical boards 9 and 9' is thin, with no margin in area for bonding the prism 17, etc., a dummy board 15 of an appropriate thickness whose material is identical with clad layers 1 and 1' is inserted between optical boards 9 and 9'. With this configuration, a plurality of optical wiring layers are provided on the board comprising electric wiring, for high-density mounting or miniaturization.
申请公布号 JP2001015871(A) 申请公布日期 2001.01.19
申请号 JP19990185874 申请日期 1999.06.30
申请人 TOPPAN PRINTING CO LTD 发明人 MINATO TAKAO;TSUKAMOTO TAKETO
分类号 H05K1/02;G02B6/122;H01L31/08;H01S5/022;(IPC1-7):H05K1/02 主分类号 H05K1/02
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