| 摘要 |
PROBLEM TO BE SOLVED: To readily and reliably rework a failed CSP(chip scale package). SOLUTION: This embodiment comprises standard CSP mounting pads P1 to P3 for mounting a chip CSP on a substrate surface layer of a memory module. In this case, this embodiment further comprises mirror face symmetrical CSP mounting pads P11 to P13 which commonly use a through via hole connected with the standard CSP mounting pads P1 to P3, and are disposed in a substrate reverse face layer symmetrically to the mirror face with respect to the standard CSP mounting pads P1 to P3. When a failure occurs in any one of the standard CSPs mounted in the substrate surface layer, after the failed CSP is removed, the mirror face symmetrical CSP is mounted in the mirror face symmetrical CSP mounting pads P11 to P13 in the substrate reverse face layer, thereby executing reworking.
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