| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation mechanism capable of efficiently discharging head generation of a semiconductor laser to the outside, in an optical pickup device using a resin frame. SOLUTION: The optical pickup device 1 is equipped with a resin frame 2 and, as mounted thereon, a semiconductor laser 3 for DVD, A flange 34 of the semiconductor laser 3 is closely stuck to a contact area 14 of a copper cooling wheel 13 attached to the rear face of the resin frame 2. The cooling wheel 13 is attached to the resin frame 2 with two metallic screws 41, 42. The heat generated by the semiconductor laser 3 is transmitted to the cooling wheel 13 through the contact area 14 and discharged to the outside through this cooling wheel 13 and the screws 41, 42. Consequently, a situation can be avoided in which the periphery of the semiconductor laser 3 is overheated, causing a bad effect such as the shorter life of the laser. |
