| 摘要 |
PROBLEM TO BE SOLVED: To accurately form a shield wall of a circuit board by containing conductive metal, insulating inorganic material, photo-polymerization initiator, organic binder containing photo-curing resin and plasticizer, and organic solvent with specific ratio. SOLUTION: When a total amount of conductive metal, insulating inorganic material, organic binder is 100 wt.%, total amount of the conductive metal and insulating inorganic material is 70-95 wt.%, and amount of organic binder is 5-30 wt.%. It is preferable that a plasticizer of 5-25 wt.% be contained in a total organic binder, dibutylphthalate and/or dioctylphthalate. Before photo- curing, it is sufficiently filled into a through hole for a via hole or a through- groove for shield because it has low viscosity, solvent is dried, then photo-curing resin is polymerized and hardened, and therefore, a composition which hardly causes swelling deformation due to solvents can be provided. Occurrence of cracks on the surface of a shield conductor can be prevented, and a shield wall having superior vertical size accuracy can be formed.
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