发明名称 Verfahren zum Kleben von Mikrostrukturen
摘要 For the adhesive bonding of microstructures, with a liquid adhesive, the partners to be joined are initially positioned laterally and pressed together with a defined force. The liquid adhesive is either applied directly and externally at the bonding surface next to the joint zone to be carried through by capillary forces into the joint. The flow spread of the adhesive is blocked by a further groove.
申请公布号 DE4414915(C2) 申请公布日期 2001.01.18
申请号 DE19944414915 申请日期 1994.04.28
申请人 FORSCHUNGSZENTRUM KARLSRUHE GMBH 发明人 FEIT, KLAUS;KELLER, WOLFGANG;MAAS, DIETER;SEIDEL, DIETER;WEINDEL, KLAUS;BUESTGENS, BURKHARD
分类号 C09J5/00;(IPC1-7):C09J5/00 主分类号 C09J5/00
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