| 摘要 |
PROBLEM TO BE SOLVED: To keep an optical semiconductor element always at a proper temperature even with a cooling member of low output, operate the optical semiconductor element normally and stably for a long period by storing the optical semiconductor element airtightly, and provide a compact and light package by preventing drop of cooling efficiency without allowing heat dissipation from a cooling member to work on an optical semiconductor element through a substrate. SOLUTION: An optical semiconductor element 4 is mounted on an upper surface of a ceramic substrate 5b at an upper side, a lower surface of a ceramic substrate at a lower side is exposed to the outside, and a metallized layer 5d is provided to a side surface of at least one ceramic substrate. A cooling member 5 wherein an electronic cooling element 5e is arranged between the ceramic substrates 5b, 5c is brazed to the inner side of a hole 1a of a frame-like substrate 1. As a result, heat generated from an optical semiconductor element 4 is emitted effectively without passing through the substrate 1, and compactness and thinning can be realized while storing the optical semiconductor element 4 airtightly. |
