SOLDER ALLOY

摘要

A lead-free solder alloy suitable for use in wave soldering and, in particular with water base VOC-free flux, low-VOC (water base) flux and low solids (solvent base flux consists of tin to which is/are added one or more of Ag in an amount of up to 10 %, Cu in an amount of up to 5 %, Sb in an amount of up to 10 % and Bi in an amount of up to 10 %, which alloy additionally contains phosphorus in an amount of up to 0.01 %, all percentages being on weight basis related to the amount of tin.