| 摘要 |
According to an example embodiment, the present invention is directed to a configurable semiconductor device wherein the placement of bond wires and bonding pads are assembled to bond internal configuration pads at the die level. One aspect of the invention is a multiple-configuration semiconductor device that includes a die package for housing a die including functional bonding pads and including target bonding pads that are immediately adjacent to one another and designated to be connected to power or common depending on a desired configuration. A bonding wire circuit includes a first plurality of bonding wires respectively connecting the functional bonding pads to selected lead fingers, and further includes a second plurality of bonding wires connecting each of at least two of the immediately-adjacent target bonding pads to power or common. The connection of the immediately-adjacent target bonding pads to power or common determines the desired configuration of the multiple-configuration semiconductor device. |
