发明名称 |
MULTICHIP MODULE AND METHOD FOR PRODUCING A MULTICHIP MODULE |
摘要 |
Multi-chip module comprises a base chip, a top chip, an adhesive layer, an electrically conducting planarizing layer, a through-hole and a contact structure. Multi-chip module comprises a base chip (10) having a passivating layer (12) and a connecting layer (14); a top chip having a passivating layer (18) and a connecting layer (20); an adhesive layer (22) between the passivating layer (12) of the base chip and the lower side of the top chip and the top chip and the base chip; an electrically conducting planarizing layer (24) on the surface of the base chip and embedded in the top chip; a through-hole (26a) filled with electrically conducting material; and a contact structure (28, 30) to connect the electrically conducting material in the through-hole to the connecting surface of the top chip. |
申请公布号 |
DE10011005(A1) |
申请公布日期 |
2001.01.18 |
申请号 |
DE2000111005 |
申请日期 |
2000.03.07 |
申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. |
发明人 |
LANDESBERGER, CHRISTOF;REICHL, HERBERT;ANSORGE, FRANK;RAMM, PETER;EHRMANN, OSWIN |
分类号 |
H01L25/18;H01L21/301;H01L21/78;H01L21/98;H01L23/52;H01L25/065;H01L25/07 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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